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Representative modular SMT component placement machine
Representative image only. Final supplied equipment and configuration are confirmed in TTC's written quotation.

Industrial & Factory Machinery

Panasonic NPM-W2 Production Modular SMT Placement Machine

A high-speed, configurable SMT production modular system for flexible electronics assembly lines.

Available on enquiryContact TTC for price

Source a configurable surface-mount technology (SMT) production modular system for electronics assembly. TTC can coordinate the manufacturer quotation, shipping, installation and training requirements, and after-sales arrangements for the selected configuration. TTC does not claim to be an authorised Panasonic representative. Final model number, head arrangement, options, software, feeders, voltage, warranty, country compatibility and lead time are confirmed in TTC's written quotation. Stated speeds, accuracy and handling ranges are configuration-dependent manufacturer reference values and are not guaranteed for every setup.

Representative specification

Final configuration confirmed on quotation. All values are representative and subject to the confirmed quoted model.

Equipment type
Electronics assembly production modular / SMT component placement system
PCB dimensions, single conveyor batch mounting
L 50 × W 50 mm to L 750 × W 550 mm
PCB dimensions, single conveyor two-position mounting
L 50 × W 50 mm to L 350 × W 550 mm
PCB dimensions, dual-conveyor dual-transfer batch
L 50 × W 50 mm to L 750 × W 260 mm
Conveyor lanes
Single or dual
Head options
Lightweight 16-nozzle V3A, lightweight 8-nozzle, or 3-nozzle V2; two head positions
Maximum placement speed
Up to 42,000 cph / 0.086 s per chip with the 16-nozzle head in high-production mode under optimum conditions; other head and configuration speeds differ
Placement accuracy (Cpk ≥ 1, optimum conditions)
±40 μm/chip for the 16-nozzle high-production configuration; options down to ±30 μm/chip depending on head and configuration
Component range
Configuration-dependent, from very small chips up to approximately L 120 × W 90 × T 30/40 mm or L 150 × W 25 × T 30/40 mm with the relevant head; not every range is supported simultaneously
Component supply
Taping, stick and tray depending on configuration
Maximum tape-fed component types
Up to 120 using 4/8 mm tape calculation
Electrical
Three-phase AC 200/220/380/400/420/480 V, 2.8 kVA
Pneumatic
0.5 MPa, 200 L/min A.N.R.
Reference dimensions
W 1,280 × D 2,465 × H 1,444 mm or W 1,280 × D 2,340 × H 1,444 mm depending on configuration
Reference mass
About 2,850 kg or 2,780 kg depending on configuration
  • High-speed modular SMT placement
  • Flexible dual-head configuration
  • Single- or dual-conveyor production
  • Tape, stick and tray supply options
  • Wide PCB and component handling range
  • Optional dispensing and 2D inspection configurations
  • Remote operation and line-support capabilities subject to selected software/options

The final make, model, price, availability, configuration and import requirements will be stated in TTC's written quotation. No lowest-price, customs, delivery-date or performance guarantee is implied.

Nansana / Kampala, Uganda

+256 7616 53353